Turnkey & Custom SoC
AdoreSys provides one-stop design services for custom SoC and turnkey solutions, including architecture planning, design integration, software and firmware development, verification, physical design, fabrication, packaging and testing.
Architecture
• Architecture & Micro-arch. Design
• Performance Optimization
• Low-Power Arch.
• Security Arch.
• Hardware/software co-design Optimization
• Functional Safety Arch.
• Chiplets Partition
Design & Verification
• IP Development
• Subsystem Design
• SoC Integration
• FuSa Implementation
• Functional Verification
• Fault Injection & Simulation
• FPGA & Emulation
• Pre & Post-Simulation
Physical Implementation
• Synthesis
• DFT & ATPG
• Placement & Routing
• Physical verification
• STA
• IR / EM / SI analysis
• PPA Sign-off
Software & Firmware
• Embedded Software
• Firmware Development
• BSP and SDK Development
• Software/Firmware Testing and Validation
• Software/Firmware Optimization
FuSa Consultation
• Fault Analysis
• Safety Features Implementation
• Fault Verification
• Traceability Management
Tape-out & MP
Strong partnership with global vendors to manage:
• Wafer Fabrication (TSMC)
• Standard & Advance Packaging
• CP & FT Testing
• Reliability
• Silicon Boot-up & Support
Subsystem Solutions
AdoreSys provides a rich portfolio of modular subsystem solutions that can be delivered as Soft-IP with verified synthesizable RTL, or as Hard-macro with PPA closure.
- XPU – CPU | GPU | NPU | etc.
- Multimedia – ISP | VSP | etc.
- HSIO – PCIe | UCIe | USB | Ethernet | etc.
- Memory – DDR/LPDDR | HBM | etc.
- Security (HSM) | Functional Safety Island (FSI) | etc.
Hardening Services
Hardening partitioned PPA critical functional blocks enables efficient complexity management, improves signal integrity, enhances manufacturability, promotes modularity for design reuse, optimizes power and thermal management and supports scalability.
Need more Information?
Talk to our technical team for a customized solution.